IBM Advances Quantum Chip Production with 300mm Semiconductor Technology

Details

• IBM announced that its Quantum Nighthawk and Loon processors, along with future devices on its quantum roadmap, are now being fabricated using advanced 300mm semiconductor wafer technology at the Albany NanoTech Complex, marking a shift from prior 200mm research-scale processes.
• This initiative is a collaboration between IBM Research Albany and the IBM Thomas J. Watson Research Center, uniting semiconductor engineers and quantum physicists across both locations.
• IBM employs a hybrid manufacturing model: the main fabrication stages leverage the high-throughput 24/7 300mm fab for speed and scalability, while select quantum-specific steps are completed on 200mm equipment, with wafers transferred as needed for final assembly and testing in dilution refrigerators.
• The transition represents a move from limited, research-oriented production to a more robust, production-like environment, enabling rapid iteration and supporting IBM’s commitment to annual chip releases through 2029—including future processor generations like Cockatoo, Starling, and Blue Jay.
• IBM’s dual access to both 200mm and 300mm fab technologies positions it uniquely in the industry, with the Albany facility’s 24/7 operation allowing shorter development cycles and the ability to test multiple chip variants simultaneously, accelerating progress toward scalable quantum computing.

Impact

IBM’s shift to 300mm production-scale quantum fabrication marks a pivotal step in moving quantum computing from laboratory research toward commercial viability. By harnessing classical semiconductor manufacturing expertise and running a continuous operation, IBM creates a formidable advantage over competitors lacking in-house production. This positions the company at the forefront of quantum hardware development as the field moves toward practical, large-scale systems.